Accession Number : ADD011722

Title :   Hermetic Chip Carrier Compliant Soldering Pads.

Descriptive Note : Patent Application,

Corporate Author : DEPARTMENT OF THE AIR FORCE WASHINGTON DC

Personal Author(s) : Hemler,

Report Date : 01 May 1985

Pagination or Media Count : 11

Abstract : Compliant soldering pads allow for expansion and contraction between an hermetic chip carriers (HCC) and printed wiring boards (PWB) due to coefficient of thermal expansion mismatch and prevent solder cracking which in turn causes electrical discontinuities. The pads allow for flexing in three axes. (Author)

Descriptors :   *CHIPS(ELECTRONICS), *SOLDERING, *PATENT APPLICATIONS, AXES, CHARGE CARRIERS, COEFFICIENTS, CRACKS, DISCONTINUITIES, ELECTRICAL PROPERTIES, HERMETIC SEALS, PRINTED CIRCUITS, THERMAL EXPANSION

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE