Accession Number : ADD012210

Title :   Non-Contact Polishing.

Descriptive Note : Patent Application,

Corporate Author : DEPARTMENT OF THE AIR FORCE WASHINGTON DC

Personal Author(s) : Ahern,Brian S

Report Date : 15 Jan 1986

Pagination or Media Count : 10

Abstract : A non-contact polishing apparatus is used for polishing semiconductor planar substrates. The substrate is set back from any surface and is held by a chuck fixed within a collar. This substrate holder assembly is placed within an enclosed container that has a non-abrasive solution therein. The container is mounted to a high speed nutating table that provides random motion to the holder assembly. This action provides isotropic polishing with no polishing created defects on the substrate surface.

Descriptors :   *PATENT APPLICATIONS, *SUBSTRATES, *POLISHING, *SEMICONDUCTORS, ASSEMBLY, HOLDERS, ISOTROPISM, MOTION, PLANAR STRUCTURES, SURFACES

Subject Categories : Mfg & Industrial Eng & Control of Product Sys
      Solid State Physics

Distribution Statement : APPROVED FOR PUBLIC RELEASE