Accession Number : ADD012210
Title : Non-Contact Polishing.
Descriptive Note : Patent Application,
Corporate Author : DEPARTMENT OF THE AIR FORCE WASHINGTON DC
Personal Author(s) : Ahern,Brian S
Report Date : 15 Jan 1986
Pagination or Media Count : 10
Abstract : A non-contact polishing apparatus is used for polishing semiconductor planar substrates. The substrate is set back from any surface and is held by a chuck fixed within a collar. This substrate holder assembly is placed within an enclosed container that has a non-abrasive solution therein. The container is mounted to a high speed nutating table that provides random motion to the holder assembly. This action provides isotropic polishing with no polishing created defects on the substrate surface.
Descriptors : *PATENT APPLICATIONS, *SUBSTRATES, *POLISHING, *SEMICONDUCTORS, ASSEMBLY, HOLDERS, ISOTROPISM, MOTION, PLANAR STRUCTURES, SURFACES
Subject Categories : Mfg & Industrial Eng & Control of Product Sys
Solid State Physics
Distribution Statement : APPROVED FOR PUBLIC RELEASE