Accession Number : ADD012387

Title :   Protected Ethynylated Phenols.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE AIR FORCE WASHINGTON DC

Personal Author(s) : Wallace,J S ; Arnold,Fred E

Report Date : 20 May 1986

Pagination or Media Count : 6

Abstract : The present invention is directed to alpha-hydroxy-, alpha alkyl-substituted acetylene compounds. Epoxy matrix composites have been widely used in aerospace products. However, epoxy matrix systems have drawbacks, not the least of which is that such systems are sensitive to moisture. Extended exposure to high humidity reduces the mechanical properties of cured epoxy systems at elevated temperatures. Accordingly, there has been considerable interest in polymers that could replace epoxies and which are significantly less sensitive to moisture, but which retain the desirable characteristics of the epoxies. A variety of acetylene-terminated resin systems have been prepared and studied in recent years. Acetylene-terminated resins cure through addition rather than condensation, thus avoiding the problem of voids caused primarily by outgassing which occurs during the condensation mechanism cure. In accordance with the present invention there is provided a novel acetylenic end-capping agent. Also provided in accordance with the invention is a method for preparing the above-described acetylenic end-capping agent. The method comprises reacting an m-halophenol with an acetylenic compound in the presence of a dialkyl or trialkylamine solvent, a Pd complex catalyst system and a cuprous salt promoter there is provided a method for adding terminal acetylene groups to a molecule which comprises reacting a halogen-terminated molecule with the above-described end-capping agent followed by base-catalyzed cleavage.

Descriptors :   *PATENTS, *ACETYLENE, *POLYMERS, *PHENOLS, SYNTHESIS(CHEMISTRY), HYDROXYL RADICALS, ALKYL RADICALS, AEROSPACE SYSTEMS, CATALYSTS, COPPER COMPOUNDS, SALTS, EPOXY COMPOUNDS, MATRIX MATERIALS, BASES(CHEMISTRY), CLEAVAGE, CONDENSATION, HIGH TEMPERATURE, EPOXY COMPOSITES, EXPOSURE(GENERAL), MECHANICAL PROPERTIES, VOIDS, HIGH HUMIDITY, OUTGASSING, MOISTURE, SENSITIVITY

Subject Categories : Plastics

Distribution Statement : APPROVED FOR PUBLIC RELEASE