Accession Number : ADD012483

Title :   Metallization for Hermetic Sealing of Ceramic Modules.

Descriptive Note : Patent Application,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s) : Morris,Hayden ; Rhodes,Henry W ; Marlow,Margaret C

Report Date : 01 Jul 1986

Pagination or Media Count : 11

Abstract : A superior hermetic seal for ceramic modules is presented. The case base member is provided with metallization around the periphery of the cavity. The case cover is provided with metallization not only to mate with the metallization of the base, but the cover metallization extends onto the thickness edge. The dimensions of the cover are less than the corresponding metallization dimensions of the base member. In this manner the solder bead formed about the periphery will wet the exposed metallization surfaces and form a visually inspectable bead.

Descriptors :   *PATENT APPLICATIONS, HERMETIC SEALS, *METALLIZING, CERAMIC COATINGS, EDGES, EXPOSURE(GENERAL), MODULES(ELECTRONICS), SEALING COMPOUNDS, SURFACES, THICKNESS

Subject Categories : Adhesives, Seals and Binders

Distribution Statement : APPROVED FOR PUBLIC RELEASE