Accession Number : ADD012686
Title : Mechanical Locking between Multi-Layer Printed Wiring Board Conductors and Through-Hole Plating.
Descriptive Note : Patent,
Corporate Author : DEPARTMENT OF THE AIR FORCE WASHINGTON DC
Personal Author(s) : Taylor,Edward
Report Date : 16 Dec 1986
Pagination or Media Count : 7
Abstract : A plated through-hole conductor structure for a multiple layer laminate electronic printed wiring board includes mechanical locking of the plated through conductor with textured conductor surfaces together with use of etching or other processing to provide laminate internal space for the mechanical locking structure. A manufacturing sequence and plural material selections are also disclosed. (Patents).
Descriptors : *PATENTS, *ETCHING, *MANUFACTURING, SEQUENCES
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE