Accession Number : ADD012752
Title : Metallographic Preparation of Pressed and Sintered Powder Metallurgy Material (Tungsten, Columbiun, Lead and Copper).
Descriptive Note : Patent Application,
Corporate Author : DEPARTMENT OF THE ARMY WASHINGTON DC
Personal Author(s) : Goodwin,Eugene L
Report Date : 28 Mar 1987
Pagination or Media Count : 9
Abstract : An object of this invention is to provide a metallographic preparation procedure for obtaining a flat and scratch free surface of a representative sample of a pressed and sintered powder metallurgy material. A further object of this invention is to provide a metallographic preparation procedure for obtaining a flat and scratch free surface of a representative sample of a pressed and sintered powder metallurgy material comprised of a composite of the refractory metals tungsten and columbium and the soft metals lead and copper. The representative samples of Table I contain hard and soft constituents. The hard constituents are refractory meatls of tungsten and columbium, and the soft constituents are soft metals of copper and lead. All samples were selected and cut from parent material and encapsulated in epoxy resin prior to polishing, Stage A. The encapsulation enabled the sample to be held during grinding and polishing for the metallographic preparation technique disclosed by the additional Stages B-E and steps outlined below.
Descriptors : *PATENT APPLICATIONS, *METALLOGRAPHY, *GRINDING, *POWDER ALLOYS, *POLISHING, COPPER, ENCAPSULATION, EPOXY RESINS, MATERIALS, METALS, NIOBIUM, POWDER METALLURGY, POWDERS, PREPARATION, REFRACTORY METALS, SAMPLING, SINTERING, TABLES(DATA), TUNGSTEN, LEAD(METAL), SYNTHESIS(CHEMISTRY), SURFACE ROUGHNESS
Subject Categories : Fabrication Metallurgy
Distribution Statement : APPROVED FOR PUBLIC RELEASE