Accession Number : ADD012759

Title :   Hermetic Chip Carrier Compliant Soldering Pads.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE AIR FORCE WASHINGTON DC

Personal Author(s) : Hemler,Paul F ; Rohr,William A

Report Date : 03 Feb 1987

Pagination or Media Count : 5

Abstract : Compliant soldering pads allow for expansion and contraction between an hermetic chip carriers (HCC) and printed wiring boards (PWB) due to coefficient of thermal expansion mismatch and prevent solder cracking which in turn causes electrical discontinuities. The pads allow for flexing in three axes. (Patents)

Descriptors :   *PATENTS, *CHIPS(ELECTRONICS), *SOLDERED JOINTS, *PADS(CUSHIONS), AXES, CHARGE CARRIERS, COEFFICIENTS, CRACKS, DISCONTINUITIES, ELECTRICAL PROPERTIES, HERMETIC SEALS, PRINTED CIRCUITS, SOLDERING, THERMAL EXPANSION

Subject Categories : Couplers, Fasteners, and Joints
      Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE