Accession Number : ADD013196
Title : Plated Bridge Step-Over Connection for Monolithic Devices and Method for Making Thereof.
Descriptive Note : Patent, Filed 15 May 81, patented 13 Mar 84,
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC
Personal Author(s) : Williams, Ralph E
Report Date : 13 Mar 1984
Pagination or Media Count : 4
Abstract : This patent discusses a step-over connection in a monolithic device including laterally spaced metalizations having upper surfaces at one or more levels above a supporting substrate and a dielectric layer over one of the metalizations. The connection is in the form of a metal bridge spanning the space between the metalizations, and is formed by successive steps of providing a first resist layer, forming openings therein, etching away an area of dielectric layer, gold plating pillars on the exposed metalization surfaces, sputtering a gold film on the first resist layer and exposed pillars, providing a second resist layer with a pillar connecting bridge pattern opening, gold plating the bridge connection on the exposed sputtered gold film, and removing the resist layers and excess gold film.
Descriptors : *PATENTS, THIN FILMS, MICROCIRCUITS, MONOLITHIC STRUCTURES(ELECTRONICS)
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE