Accession Number : ADD013543
Title : Film Chip Capacitor.
Descriptive Note : Patent, Filed 4 Nov 85, patented 22 Sep 87,
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC
Personal Author(s) : Robbins, William L
Report Date : 22 Sep 1987
Pagination or Media Count : 4
Abstract : A chip capacitor comprising a plurality of parallel plastic organic film layers which film layers may further include organically bonded ceramic particles, interleaved with multiple thin parallel non-precious metal electrode film layers of aluminum, copper or the like, the capacitor further comprising suitable non-precious metal end caps and connector means the surfaces of adjacent dielectric films and electrodes being bonded together using bonding agents selected to provide the mechanical stability of the film chip capacitor.
Descriptors : *PATENTS, *CAPACITORS, *CHIPS(ELECTRONICS), *FILMS, ALUMINUM, BONDING, CHEMICAL AGENTS, COPPER, DIELECTRIC FILMS, ELECTRODES, LAYERS, LOW COSTS, MECHANICAL PROPERTIES, METALS, STABILITY
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE