Accession Number : ADD013613
Title : Superior Ohmic Contacts to III-V Semiconductor by Virtue of Double Donor Impurity.
Descriptive Note : Patent, Filed 25 Mar 81, patented 17 Aug 82,
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC
Personal Author(s) : Yoder, Max N
Report Date : 17 Aug 1982
Pagination or Media Count : 4
Abstract : A method for fabricating superior ohmic contacts in a III-V semiconductor water by virtue of double donor (or double acceptor) impurity complex formation. A typical III-V, e.g. GaAs, semiconductor device is fabricated by depositing a thin S13N4 layer and then regions are opened, by photoresist methods, upon which ohmic contacts are to be made. New resist is applied over the wafer and the ohmic contact regions are again opened. Si ions are now implanted to form the active channel and the drain and source regions (in an FET device). The resist layer is removed, a layer of Ge is laid down and a layer of Se over the Ge. The Ge layer is coated with a layer of SiO2, Si3N4 or a mixture of both, and annealed, causing the Ge and Se to diffuse rapidly into the Si ion implant region. The SiO2, Si3N4 and excess surface Ge and Se is now removed. Metallization of the electrode areas, preferably with reliable refractory metals, is effected, producing ohmic tunneling contacts over the Ge/Se diffused regions and rectifying, nonohmic, Schottky barrier contacts over the selected remainder of the Si-implanted region.
Descriptors : *ELECTRIC CONTACTS, *PATENTS, *FIELD EFFECT TRANSISTORS, *GROUP III COMPOUNDS, *GROUP V COMPOUNDS, *IMPURITIES, *ION IMPLANTATION, *PHOTORESISTORS, *SCHOTTKY BARRIER DEVICES, *SEMICONDUCTOR DEVICES, CHANNELS, DIFFUSION, ELECTRODES, ELECTRON ACCEPTORS, IONS, REFRACTORY METALS, RELIABILITY, SEMICONDUCTORS, SOURCES, TUNNELING, WATER
Subject Categories : Solid State Physics
Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE