Accession Number : ADD013917

Title :   Platinum and Platinum Silicide Contacts on Beta-Silicon Carbide Specification.

Descriptive Note : Patent Application, Filed 25 Oct 88,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s) : Panacolaou, Nicolas A

Report Date : 25 Oct 1988

Pagination or Media Count : 13

Abstract : This invention relates to contact metallization on silicon carbide, specifically, to Schottky contacts of platinum and platinum silicide on Beta-silicon carbide. It is an object of this invention to provide a rugged and thermally stable rectifying contact metallization on SiC for high temperature semiconductor device applications. Additionally, it is an object of this invention to provide a Schottky metallization which has higher thermal stability than conventional gold metallization. Further, it is an object of this invention to provide a Schottky metallization which has superior adhesion properties to conventional gold metallization. Patent applications. (JES)

Descriptors :   *PATENT APPLICATIONS, *PLATINUM COMPOUNDS, *SILICON CARBIDES, ADHESION, GOLD, METALLIZING, PLATINUM, SCHOTTKY BARRIER DEVICES, SILICIDES, THERMAL STABILITY

Subject Categories : Inorganic Chemistry

Distribution Statement : APPROVED FOR PUBLIC RELEASE