Accession Number : ADD014159

Title :   Fluorinated Epoxy Resins with High Glass Transition Temperatures.

Descriptive Note : Patent Application, Filed 27 Mar 89,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s) : Griffith, James R

Report Date : 27 Mar 1989

Pagination or Media Count : 19

Abstract : An object of this invention is to provide a fluoroepoxy resin with a high glass transition temperature. And, an object of this invention is to provide a fluoroepoxy resin for use in computer composite circuit boards. Also, an object of this invention is to provide a fluoroepoxy resin which will withstand a processing temperature of 250C and an operating temperature of 100C. Further, an object of this invention is to provide a curing agent for epoxy resins which will increase the glass transition temperature of these resins. These and other objects are accomplished by a 'glassy state' curing agent containing a monoanhydride and a dianhydride which when mixed with an epoxy resin produces a polymer with higher crosslink densities, resulting in higher glass transition temperatures. Keyword: Patent applications (AW)

Descriptors :   *CIRCUIT BOARDS, *CURING AGENTS, *EPOXY RESINS, *FLUOROPOLYMERS, *PATENT APPLICATIONS, COMPUTERS, CROSSLINKING(CHEMISTRY), DENSITY, FLUORINE, GLASS, HIGH TEMPERATURE, POLYMERS, TRANSITION TEMPERATURE, VITREOUS STATE, ANHYDRIDES

Subject Categories : Plastics
      Industrial Chemistry and Chemical Processing
      Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE