Accession Number : ADD014796

Title :   Fluorinated Epoxy Resins with High Glass Transition Temperatures.

Descriptive Note : Patent, Filed 27 Mar 89, patented 1 Jan 91,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s) : Griffith, James R

Report Date : 01 Jan 1991

Pagination or Media Count : 8

Abstract : Fluoroepoxy resins for use in computer composite circuit boards. A 'glass state' curing agent containing a fluorinated monoanhydride, a fluorinated dianhydride and a catalyst is compounded at a temperature of about 210 C. The curing agent is blended with di- and tri-functional epoxy resins at 100 C. or higher to give homogeneous fat-curing syrups. Fluoroepoxy resins inherently have low dielectric constants. This method produces a fluoroepoxy resin with high crosslink densities and higher glass transition temperatures.

Descriptors :   CATALYSTS, CIRCUIT BOARDS, COMPUTERS, CONSTANTS, CROSSLINKING(CHEMISTRY), CURING AGENTS, DIELECTRIC PROPERTIES, EPOXY RESINS, FLUORINE, FLUOROPOLYMERS, GLASS, HIGH DENSITY, HIGH TEMPERATURE, TRANSITION TEMPERATURE

Subject Categories : Plastics

Distribution Statement : APPROVED FOR PUBLIC RELEASE