Accession Number : ADD014814
Title : High Speed Parallel Backplane.
Descriptive Note : Patent application, filed 29 Jan 90,
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC
Personal Author(s) : Corda, Albert J
Report Date : 29 Jan 1990
Pagination or Media Count : 11
Abstract : This invention relates to high speed data processing in particular to a high speed parallel backplane for interconnecting a plurality of printed circuit boards in a parallel processing system. The conventional approach to parallel backplane design utilizes a set of circuit board connectors mounted on a flat supporting structure typically made of phenolic glass-epoxy. Common bus pins are interconnected via a set of linear metallized traces deposited on the supporting structure. Although this technique is acceptable for systems supporting low bandwidth exceeds 15 MHz. Of all the physical parameters which affect bus bandwidth, signal path length is the most crucial. According to the law of electromagnetics, when a signal path length approaches a quarter wavelength of operating frequency, radiative losses occur.
Descriptors : BANDWIDTH, CIRCUIT BOARDS, CONNECTORS, DATA PROCESSING, ELECTROMAGNETIC FIELDS, EPOXY COMPOUNDS, GLASS, HIGH RATE, LENGTH, LOSSES, METALLIZING, PARALLEL PROCESSING, PATHS, PHENOLS, PHYSICAL PROPERTIES, PINS, PRINTED CIRCUIT BOARDS, PROCESSING, RADIATION, SIGNALS
Subject Categories : Computer Programming and Software
Distribution Statement : APPROVED FOR PUBLIC RELEASE