Accession Number : ADD014882
Title : Method and Device for Stand-Off Laser Drilling and Cutting.
Descriptive Note : Patent, Filed 7 Oct 88, patented 26 Sep 89,
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC
Personal Author(s) : Copley, John A ; Kwok, Hoi S ; Domankevitz, Yacov
Report Date : 26 Sep 1989
Pagination or Media Count : 7
Abstract : A device for perforating material and a method of stand-off drilling using a laser. In its basic form a free-running laser beam creates a melt on the target and then a Q-switched short duration pulse is used to remove the material through the creation of a laser detonation wave. The advantage is a drilling/cutting method capable of working a target at lengthy stand-off distance. The device may employ 2 lasers or a single one operated in a free-running/Q-switched dual mode.
Descriptors : CUTTING, DETONATION WAVES, DRILLING, LASERS, MATERIALS, MELTS, PERFORATION, Q SWITCHING, RANGE(DISTANCE), SHORT PULSES, SHORT RANGE(TIME), STANDOFF, TARGETS
Subject Categories : Machinery and Tools
Lasers and Masers
Distribution Statement : APPROVED FOR PUBLIC RELEASE