Accession Number : ADD015187

Title :   Heat Sink Device for Electronics Modules Packaged in Cylindrical Casings.

Descriptive Note : Patent, Filed 28 Sep 90, patented 22 Oct 91,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s) : Sewell, Mark W

Report Date : 22 Oct 1991

Pagination or Media Count : 6

Abstract : A device for dissipating heat from electronics encased in a circular housing is disclosed for uses in buoys, sonobuoys, mines and missiles. The device contains a heat dissipating ring that engages the inner surface of the cylindrical electronics case. The inside surface of this ring is tapered to receive a heat transfer disk that is pulled into tight union with the heat dissipating ring. A heat generating module is mounted in heat transfer union with the disk whereby excess heat is transferred from the disk through the ring to the electronics case where it is dissipated into the environment. (Author)

Descriptors :   BUOYS, CIRCULAR, CYLINDRICAL BODIES, DISKS, ELECTRONICS, HEAT, HEAT SINKS, HEAT TRANSFER, HOUSING(DWELLINGS), INTERNAL, MODULAR CONSTRUCTION, MODULES(ELECTRONICS), SONOBUOYS, SURFACES, TAPER, TIGHTNESS

Subject Categories : Electrical and Electronic Equipment
      Thermodynamics

Distribution Statement : APPROVED FOR PUBLIC RELEASE