Accession Number : ADD015804

Title :   Ultrahigh Density Charge Transfer Device.

Descriptive Note : Patent application, filed 11 May 93,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s) : Huber, Carmen I ; Huber, Tito E ; Caviris, Nicholas

Report Date : 11 May 1993

Pagination or Media Count : 13

Abstract : Metal heated to a molten state is injected under a high hydrostatic penetration pressure into extremely small and closely spaced channels of an insulating matrix to form an array of electrically conductive pins or wires. The materials for the pins and matrix are selected for compatibility with respect to melting, matrix sintering and surface tension penetration conditions associated with the fabrication of a high density charge transfer device

Descriptors :   *LIGHT MODULATORS, *CHARGE TRANSFER, *DRAWING(FORMING), *PATENT APPLICATIONS, PINS, METAL MATRIX COMPOSITES, ELECTRICAL CONDUCTIVITY, HIGH DENSITY, SINTERING, FABRICATION, MELTING, INJECTION MOLDING, HYDROSTATIC PRESSURE, CHARGE DENSITY, WIRE

Subject Categories : Optics
      Electricity and Magnetism
      Fabrication Metallurgy

Distribution Statement : APPROVED FOR PUBLIC RELEASE