Accession Number : ADD016019

Title :   High Temperature Adhesive.

Descriptive Note : Patent, Filed 26 Feb 92, patented 7 Sep 93,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s) : Keller, Teddy M ; Roland, Charles M

Report Date : 07 Sep 1993

Pagination or Media Count : 7

Abstract : A substrate assembly and method for its preparation, said substrate assembly comprising at least two substrates adhesively bonded with a cured thermosetting polymer being able to withstand a temperature of 200 deg-400 deg C. which polymer is derived from a diphthalonitrile monomer and/or prepolymer with an aromatic moiety in the bridging group which monomer and/or prepolymer is solid at room temperature but which is rendered liquid by heating it to above its melting temperature. Said monomer in liquid state, and its prepolymer in liquid state, have tack with respect to said substrate.

Descriptors :   *PATENTS, *HIGH TEMPERATURE, *ADHESIVES, HEATING, LIQUIDS, MELTING, MONOMERS, POLYMERS, PREPARATION, ROOM TEMPERATURE, SOLIDS, SUBSTRATES, TEMPERATURE, THERMOSETTING PLASTICS, NITRILES

Subject Categories : Adhesives, Seals and Binders
      Thermodynamics
      Polymer Chemistry

Distribution Statement : APPROVED FOR PUBLIC RELEASE