Accession Number : ADD016584

Title :   Module Cooling System.

Descriptive Note : Patent, Filed 25 Jun 93, patented 5 Jul 94,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s) : Altoz, Frank E

Report Date : 05 Jul 1994

Pagination or Media Count : 6

Abstract : An apparatus is provided for cooling electronic components mounted on a circuit board. The circuit board is placed in thermal contact with a heat sink enclosure that has an interior cavity and a release opening that provides a path from the interior cavity to the external ambient. A meltable pellet blocks the release opening. A wick is bonded to the inside surface of the interior cavity. The device is sealed with a working fluid that permeates the wick. When the components get hot, the heat is transferred through the heat sink enclosure to the working fluid in the wick, causing the working fluid to vaporize. The vapors remain trapped in the interior cavity until the pellet melts, allowing the vapor to be released and the temperature of the heat sink enclosure to be stabilized or lowered.

Descriptors :   *CIRCUIT BOARDS, *COOLING, *PATENTS, *MODULES(ELECTRONICS), CAVITIES, ELECTRONICS, EXTERNAL, FLUIDS, HEAT SINKS, MELTS, OPENINGS, PATHS, PELLETS, RELEASE, SURFACES, TEMPERATURE, VAPORS, THERMAL PROPERTIES, GUIDED MISSILES

Subject Categories : Electrical and Electronic Equipment
      Air Condition, Heating, Lighting & Ventilating
      Guided Missiles
      Thermodynamics

Distribution Statement : APPROVED FOR PUBLIC RELEASE