Accession Number : ADD017468
Title : Diamond Multilayer Multichip Module Substrate.
Descriptive Note : Patent, Filed 16 Mar 94, Patent-5 391 914
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC
Personal Author(s) : Sullivan, Patrick M ; Reaves, Pat H
Report Date : 21 Feb 1995
Pagination or Media Count : 6
Abstract : Diamond is used as a dielectric layer to separate the metalization layers in multichip module substrates. The diamond has use for both electrical and thermal conclusion. Such multichip module substrates may have a diamond base, or a base constructed from silicon, aluminum altride, molybdenum, or any other material supportive of the nucleation and growth of diamond films. The metalization may be molybdenum or other conductor supportive of the nucleation and growth of diamond films. Using diamond as an interlayer dielectric in a multiclip system permits a significant increase in the amount of power that can be dissipated by the system. The diamond does not obstruct the system's metalization, so that routing density can be increased and interconnection length may be decreased, enhancing host chip operation.
Descriptors : *CHIPS(ELECTRONICS), *SUBSTRATES, *MODULES(ELECTRONICS), *PATENTS, LAYERS, DIELECTRICS, FILMS, DIAMONDS, MOLYBDENUM, NUCLEATION, ALUMINUM, LENGTH, SILICON, CIRCUIT INTERCONNECTIONS, CRYSTAL GROWTH, METALLIZING
Subject Categories : Electrical and Electronic Equipment
Solid State Physics
Distribution Statement : APPROVED FOR PUBLIC RELEASE