Accession Number : ADD017588

Title :   Glassy Binder System for Ceramic Substrates, Thick Films and the Like.

Descriptive Note : Patent, Filed 9 Feb 89, patented 16 May 95,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s) : Mattox, Douglas M

Report Date : 16 May 1995

Pagination or Media Count : 5

Abstract : A ceramic material for electronic circuit devices is sintered at less than or equal to 1000 deg C. temperature. A filler material such as quartz and a glassy binder RO-Al2O3-B2O3 are mixed together along with an appropriate glassy binder prior to firing. RO is drawn from the group of metal oxides MgO, CaO, SrO, BaO, ZnO or CdO and the glassy binders form no more than 40 vol % of the ceramic material. The glassy binder has a suitable viscosity and other properties so that after it is mixed with the quartz filler, sintering occurs at the relatively low temperature. As a consequence, high conductivity conductors made of copper, silver and gold can be appropriately metallized prior to firing. The strength and low dielectric constant of the ceramic material make the material well adapted for ceramic substrates, thick films and the like which are used in VHSIC and VLSI applications. jg p.1

Descriptors :   *INTEGRATED CIRCUITS, *GLASS, *CERAMIC MATERIALS, *BINDERS, *THICK FILMS, *PATENTS, LOW TEMPERATURE, HIGH RATE, CONDUCTIVITY, MATERIALS, ELECTRONIC EQUIPMENT, VERY LARGE SCALE INTEGRATION, SUBSTRATES, DIELECTRIC PROPERTIES, QUARTZ, OXIDES, ALUMINUM OXIDES, COPPER, ZINC OXIDES, CONSTANTS, GOLD, VISCOSITY, STRONTIUM, SILVER, METAL COMPOUNDS, ELECTRIC CONDUCTORS, SINTERING, CALCIUM OXIDES, FILLERS, MAGNESIUM OXIDES, BARIUM OXIDES

Subject Categories : Inorganic Chemistry
      Electrical and Electronic Equipment
      Ceramics, Refractories and Glass

Distribution Statement : APPROVED FOR PUBLIC RELEASE