Accession Number : ADD017607
Title : Process to Fabricate Thick Coplanar Microwave Electrode Structures.
Descriptive Note : Patent, Filed 18 Jun 93, patented 10 Apr 95.
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC
Personal Author(s) : McElhanon, Robert W ; Gopalakrishnan, Ganesh K ; Burns, William K
Report Date : 18 Apr 1995
Pagination or Media Count : 9
Abstract : A process for making thick metal structures on a substrate has the steps of: selectively exposing a thick layer of photoresist disposed on a substrate to ultraviolet radiation including the 350 nm to 450 nm portion of tile spectrum of a mercury vapor lamp, where the photoresist layer is a heat-treated arid hydrated photoresist layer, to fully pattern the substrate: developing the patterned substrate by contacting the photoresist layer with a photoresist developing solution; exposing the photoresist layer to a plasma for hardening the pattern against thermal flow; hardbaking the photoresist pattern on the substrate; plating the metal onto the patterned substrate using a low current density (J) during at least part of the plating process, making a thick methyl structure on the substrate. jg p.1
Descriptors : *MICROWAVES, *ELECTRODES, *PATENTS, METALS, THICKNESS, ULTRAVIOLET RADIATION, SOLUTIONS(MIXTURES), METHYL RADICALS, LAYERS, VAPORS, PLASMAS(PHYSICS), STRUCTURES, FABRICATION, CURRENT DENSITY, SUBSTRATES, SPECTRA, LOW DENSITY, HEAT FLUX, HARDENING, TILES, PLATING, PHOTORESISTORS, MERCURY LAMPS
Subject Categories : Electrical and Electronic Equipment
Electricity and Magnetism
Radiofrequency Wave Propagation
Distribution Statement : APPROVED FOR PUBLIC RELEASE