Accession Number : ADD017844

Title :   Adhesion Enhancement for Underplating Problem.

Descriptive Note : Patent Application, Filed 31 Jan 96,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s) : Burns, William K ; McElhanon, Robert W

PDF Url : ADD017844

Report Date : 31 Jan 1996

Pagination or Media Count : 24

Abstract : Underplating between a metallic plating base and a photoresist deposited thereon can be reduced or eliminated by a method of fabricating a microstructure which includes the steps of: (a) depositing a plating base on the adhesion layer; (b) depositing on the plating base a sacrificial layer of a material that reduces or eliminates underplating on the plating base compared to underplating in absence of the sacrificial layer; (c) depositing a photoresist on the sacrificial layer; (d) exposing, developing and removing the exposed photoresist from the substrate to uncover a portion of the sacrificial layer; (e) removing the sacrificial layer portion from the substrate to uncover a portion of the plating base; and (f) depositing a metallic material on the uncovered plating base under the influence of electrical current. jg p23

Descriptors :   *PATENT APPLICATIONS, *ADHESION, *PLATING, METALS, REMOVAL, MICROSTRUCTURE, OPTIMIZATION, EXPOSURE(GENERAL), LAYERS, MATERIALS, SUBSTRATES, ELECTRIC CURRENT, PHOTORESISTORS

Subject Categories : Adhesives, Seals and Binders
      Inorganic Chemistry
      Physical Chemistry
      Coatings, Colorants and Finishes

Distribution Statement : APPROVED FOR PUBLIC RELEASE