Accession Number : ADD018390
Title : Semiconductor-on-Insulator Device Interconnects.
Descriptive Note : Patent, Filed 11 Jul 91, patented 24 Dec 96,
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON DC
Personal Author(s) : Reedy, Ronald E ; Garcia, Graham A ; Lagnado, Isaac
Report Date : 24 Dec 1996
Pagination or Media Count : 9
Abstract : A process for developing conductive interconnect regions between integrated circuit semiconductor devices formed on an insulating substrate utilizes the semiconductor material itself for formation of device interconnect regions. A patterned layer of semiconductor material is formed directly on the surface of an insulating substrate. The patterned layer includes regions where semiconductor devices are to be formed and regions which are to be used to interconnect terminals of predetermined ones of the semiconductor devices. After forming the semiconductor devices in selected regions of the semiconductor material, the regions of the semiconductor material patterned for becoming interconnects are converted to a metallic compound of the semiconductor material.
Descriptors : *INTEGRATED CIRCUITS, *SEMICONDUCTOR DEVICES, *CIRCUIT INTERCONNECTIONS, *PATENTS, SUBSTRATES, PACKING DENSITY, ELECTRICAL INSULATION, DISSIPATION FACTOR
Subject Categories : Electrical and Electronic Equipment
Solid State Physics
Distribution Statement : APPROVED FOR PUBLIC RELEASE