Accession Number : ADD095041

Title :   Diffusion in Copper and Copper Alloys, Part III. Diffusion in Systems Involving Elements of the Groups IA, IIA, IIIB, IVB, VB, VIB, and VIIB,

Corporate Author : NATIONAL STANDARD REFERENCE DATA SYSTEM

Personal Author(s) : Butrymowicz, Daniel B ; Manning, John R ; Read, Michael E

Report Date : Jan 1975

Pagination or Media Count : 77

Abstract : A survey, comparison, and critical analysis is presented of data compiled from the scientific literature concerning diffusion in copper alloy systems involving elements in Groups IA, IIA, IIIB, IVB, VB, VIB, and VIIB. Here the term 'copper alloy systems' is interpreted in the broadest sense. For example, the review of diffusion in the Cu-M system reports all diffusion situations which involve both copper and element M, including diffusion of Cu in M or in any binary, ternary or multicomponent alloy containing M; diffusion of M in Cu or in any alloy containing Cu; and diffusion of any element in any alloy containing both Cu and M. Topics include volume diffusion, surface diffusion, grain boundary diffusion, tracer diffusion, alloy interdiffusion, electromigration, thermomigration, dislocation-pipe diffusion, and diffusion in molten metals. An extensive bibliography is presented along with figures, tabular presentation of data and discussion of results. (Author)

Descriptors :   *GRAIN BOUNDARIES, *DIFFUSION, *COPPER ALLOYS, *LITERATURE SURVEYS, MELTS, TABLES(DATA), TABULATION PROCESSES, SCIENTIFIC LITERATURE, SURFACES, MIGRATION, ELECTRON MOBILITY, IMPURITIES, GROUP II COMPOUNDS, GROUP I COMPOUNDS, GROUP III COMPOUNDS, GROUP IV COMPOUNDS, GROUP V COMPOUNDS, DISLOCATIONS, GROUP VI COMPOUNDS, GROUP VII COMPOUNDS

Subject Categories : Properties of Metals and Alloys

Distribution Statement : APPROVED FOR PUBLIC RELEASE