Accession Number : ADD095083

Title :   Diffusion in Copper and Copper Alloys. Part V. Diffusion in Systems Involving Elements of Group VA,

Corporate Author : NATIONAL STANDARD REFERENCE DATA SYSTEM

Personal Author(s) : Butrymowiez, Daniel B ; Manning, John R ; Read, Michael E

Report Date : Jan 1977

Pagination or Media Count : 54

Abstract : A survey, comparison, and critical analysis is presented of data compiled from the scientific literature concerning diffusion in copper alloy systems involving elements in Group VA (As, Bi, N, P, Sb). Here the term 'copper alloy system' is interpreted in the broadest sense. For example, the review of diffusion in the Cu-M system reports all diffusion situations which involve both copper and element M, including diffusion of Cu in M or in any binary, ternary, or multicomponent alloy containing M; diffusion of M in Cu or in any alloy containing Cu; and diffusion of any element in any alloy containing both Cu and M. Topics include volume diffusion, grain boundary diffusion, tracer diffusion, alloy interdiffusion, electromigration, thermomigration, strain-enhanced diffusion and diffusion in molten metals. An extensive bibliography is presented along with figures, tabular presentation of data, and discussion of results. (Author)

Descriptors :   *COPPER, *COPPER ALLOYS, *DIFFUSION, VOLUME, TRACER STUDIES, GRAIN BOUNDARIES, SURFACE CHEMISTRY, ELECTROOSMOSIS, THERMAL DIFFUSION, ANTIMONY, ARSENIC, BISMUTH, NITROGEN, PHOSPHORUS, DIFFUSION COEFFICIENT, GRAPHS

Subject Categories : Inorganic Chemistry

Distribution Statement : APPROVED FOR PUBLIC RELEASE