Accession Number : ADP002438
Title : Recent Results on Fracture Toughness of Bonded Wood,
Corporate Author : WISCONSIN UNIV-MADISON DEPT OF CHEMICAL ENGINEERING
Personal Author(s) : Koutsky,J. A.
Report Date : 25 SEP 1980
Pagination or Media Count : 6
Abstract : This paper summarizes the influence of the following bonding variables on fracture toughness: Bondline thickness; Wood grain angle with respect to the plane of the bondline, Wood surface roughness; Wood moisture content; Aging of wood surface; Adhesive cure time; Initial adhesive viscosity; and Effect of adhesive fillers. Most of the data is from HTDCB(Height Tapered Double Cantilever Beam Specimens) studies, but some recent WTDCB(Width Tapered Double Cantilever Beam Specimens) results (which are more applicable specimens for laminate studies) are also reported.
Descriptors : *Wood, *Adhesives, *Adhesive bonding, Toughness, Fracture(Mechanics), Bonding, Moisture content, Aging(Materials), Surface roughness, Curing, Viscosity, Test methods, Symposia
Distribution Statement : APPROVED FOR PUBLIC RELEASE