Accession Number : ADP003564

Title :   Navy Packaging Standardization Thrusts,

Corporate Author : NAVAL AVIONICS CENTER INDIANAPOLIS IN

Personal Author(s) : Kidwell,J. R.

Report Date : NOV 1982

Pagination or Media Count : 16

Abstract : Standardization is a concept that is basic to our world today. The idea of reducing costs through the economics of mass production is an easy one to grasp. Henry Ford started the process of large scale standardization in this country with the Detroit production lines for his automobiles. In the process additional benefits accured, such as improved reliability through design maturity, off-the-shelf repair parts, faster repair time, and a resultant lower cost of ownership (lower life-cycle cost). The need to attain standardization benefits with military equipments exists now. Defense budgets, although recently increased, are not going to permit us to continue the tremendous investment required to maintain even the status quo and develop new hardware at the same time. Needed are more reliable, maintainable, testable hardware in the Fleet. It is imperative to recognize the obsolescence problems created by the use of high technology devices in our equipments, and find ways to combat these shortfalls. The Navy has two packaging standardization programs that will be addressed in this paper; the Standard Electronic Modules and the Modular Avionics Packaging programs. Following a brief overview of the salient features of each program, the packaging technology aspects of the program will be addressed, and developmental areas currently being investigated will be identified. (Author)

Descriptors :   *Modules(Electronics), *Standardization, Navy, Packaging, Avionics, Integrated circuits

Distribution Statement : APPROVED FOR PUBLIC RELEASE