Accession Number : ADP005177

Title :   In-Line High Pressure Solvent Cleaning of Surface Mounted Assemblies. Part 1,

Corporate Author : ELECTROVERT LTD LAPRAIRIE (QUEBEC)

Personal Author(s) : Elliott,Donald A. ; Gileta,John

Report Date : FEB 1987

Pagination or Media Count : 11

Abstract : A test board containing 41 surface mounted components was soldered using RMA solder paste through a flat mesh belt type infrared system and subsequently cleaned in a new in-line conveyorized solvent cleaner using high pressure spray of the stabilized azeotrope of trichlorotrifluoroethane and methyl alcohol. Cleaning results are improved with longer dwell times at lower conveyor speeds. All flux residues are removed beneath leaded SOIC and similar components but not from beneath chip components and LCC's at a speed of 3 ft/min (90 cm/min) when using a spray pressure of 35 psi (2.4 bars). Keeping the conveyor speed constant, the addition of ultrasonic agitation provides a remarkable improvement. Solvent spray cleaning in the new in-line cleaner described in this paper and tested at pressures up to 250 psi (17 bars) proves to be a viable alternative for removing rosin flux residues from electronic printed wiring assemblies containing all types of surface mount components including chips and LCC's where ultrasonic cleaning is prohibited or where damage may occur to certain electronic components. (Author)

Descriptors :   *CHEMICAL CLEANING, *SOLVENTS, *PRINTED CIRCUIT BOARDS, SOLDERED JOINTS, SPRAYS, DWELL TIME, SOLDERING FLUXES, HALOGENATED HYDROCARBONS, ALCOHOLS, CANADA

Subject Categories : Mfg & Industrial Eng & Control of Product Sys
      Solvents, Cleaners, and Abrasives
      Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE