Accession Number : ADP005194

Title :   Solderability: The Key to Successful Surface Mount Assembly,

Corporate Author : GTE GOVERNMENT SYSTEMS CORP NEEDHAM HEIGHTS MA COMMUNICATION SYSTEMS DIV

Personal Author(s) : Murphy,Richard

Report Date : FEB 1987

Pagination or Media Count : 14

Abstract : Surface Mount Technology, a state-of-the-art manufacturing process, is recognized as a primary path to increased productivity, product differentiation and long range cost reduction. Through meticulous solderability control of the starting materials (solder paste, components and boards) used in the assembly process, cost effective manufacture of high reliability electronic products is enhanced. The solderability of the starting materials can have a significant positive or negative impact on the subsequent assembly process, and hence the quality of the final product. Because of this potential impact, several measures have been taken to ensure optimum solderability of the input materials used in the Surface Mount Assembly process. These measures include testing and preparation of the paste, components and bareboards. This paper provides information on the successful manufacture high reliability products utilizing surface mount assemblies.

Descriptors :   *SOLDERING, *PRINTED CIRCUITS, RELIABILITY, SOLDERED JOINTS, ASSEMBLY, STATE OF THE ART

Subject Categories : Mfg & Industrial Eng & Control of Product Sys
      Couplers, Fasteners, and Joints

Distribution Statement : APPROVED FOR PUBLIC RELEASE