Accession Number : ADP005195

Title :   Today and Tomorrow in Soldering,

Corporate Author : TEXAS INSTRUMENTS INC DALLAS DEFENSE SYSTEMS AND ELECTRONICS GROUP

Personal Author(s) : Yenawine,Roy ; Wolverton,Mike ; Burkett,Alan ; Waller,Barbara ; Russell,Bill

Report Date : FEB 1987

Pagination or Media Count : 37

Abstract : Improvements are achieved in solderability for the old Plated-Through-Hole (PTH) Technology. The Military Specifications, general rules, and attitudes required to achieve solderable leads are in place with a majority of manufacturers. This paper describes the status of lead solderability quality for PTH assemblies, and what must be done stay on the right track and to maintain the momentum developed at much effort and expense. In the future, Surface Mount Technology (SMT) will certainly be predominant. This paper covers the potential pitfalls in SMT applications.

Descriptors :   *SOLDERING, *PRINTED CIRCUITS, SPECIFICATIONS, MILITARY APPLICATIONS, INDUSTRIAL RESEARCH, STATE OF THE ART, RISK

Subject Categories : Mfg & Industrial Eng & Control of Product Sys
      Couplers, Fasteners, and Joints

Distribution Statement : APPROVED FOR PUBLIC RELEASE