Accession Number : ADP005200
Title : SMD Soldering Technology Development at Government Systems Operations, Control Data Corporation,
Corporate Author : CONTROL DATA CORP MINNEAPOLIS MN GOVERNMENT SYSTEMS MFG DIV
Personal Author(s) : Pai,Deepak K.
Report Date : FEB 1987
Pagination or Media Count : 36
Abstract : A general discussion dealing with the design for manufacturability and manufacturing of surface mount assemblies will be addressed, including the development of the soldering of surface mount leadless, and fine-pitch, high-lead-count, gull wing chip carriers. Product design and manufacturing processes are predominantly driven to meet the requirements for advanced military computers. SMD soldering technology developed with the Navy's sponsored program, CIRCUIT CARD ASSEMBLY AND PROCESSING SYSTEM (CCAPS), methodology.
Descriptors : *SOLDERING, *PRINTED CIRCUIT BOARDS, CHIPS(ELECTRONICS), MANUFACTURING, ASSEMBLY, RELIABILITY(ELECTRONICS), SOLDERING FLUXES, SELECTION, CONTROL
Subject Categories : Mfg & Industrial Eng & Control of Product Sys
Couplers, Fasteners, and Joints
Distribution Statement : APPROVED FOR PUBLIC RELEASE